Lithography Equipment

EUV Systems

Tin plasma source, multilayer mirrors, and vacuum operation

EUV Scanner Architecture

EUV Scanner Architecture

ASML's EUV scanners are the most complex and expensive machines in the world:

  • Source: A 25 kW CO₂ laser fires 50,000 pulses/second at 30 µm tin droplets traveling at 70 m/s. Each droplet is hit twice — a pre-pulse flattens it, then the main pulse creates a 13.5 nm-emitting plasma. Source power: 250–500W.
  • Collector mirror: A huge ellipsoidal mirror (with Mo/Si multilayer coating) captures 5 sr of the emitted EUV light and focuses it to the intermediate focus.
  • Illuminator & projection optics: 11 total mirrors, each with >65% reflectivity. Combined optical efficiency is ~2%, so the 250W source delivers only ~5W at the wafer.
  • Vacuum system: The entire optical path is in ultra-high vacuum. Hydrogen gas flows over mirrors to remove tin debris.
  • Reticle handling: EUV masks are reflective and must be stored and transported in special protective pods (no pellicle was available initially).

An EUV scanner contains 100,000+ parts, weighs 180 tons, requires 3 cargo planes to ship, and costs $350+ million.

Key Concept: High-NA EUV

ASML's next-generation High-NA EUV (0.55 NA vs 0.33 NA) will use anamorphic optics (different magnification in X and Y) and a larger mirror set. It enables single-exposure patterning at ~8 nm half-pitch. Cost: $380+ million per tool.

Knowledge Check

Knowledge Check

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How many parts does an EUV scanner contain?